Smallest RISC-V Device for Next-Generation Edge Computing
summary
A 14 nm RISC‑V system shrinks a processor die to ~0.07 mm² with a separate 32 KB SRAM die (~0.04 mm²) and a <1 mm² silicon interposer using 20 µm bumps for 2.5D integration. On‑chip SRAM reduces to ~2 KB, instruction memory moves to external flash over an 8‑bit SPI bus because of a 30‑pad limit, and a hardware SHA-256 auth engine yields ~20× faster auth. Communication uses an optical micro‑LED UART with HDLC framing; first silicon boots, accepts app upload and runs.
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chapters (8)
- 0:00Project goals and background
- 1:34System design requirements
- 3:15First-generation architecture
- 4:38Memory and performance tuning
- 8:02Hardware acceleration
- 9:40Testing and validation
- 11:37Future outlook and conclusions
- 13:36Q&A and technical rationale
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