The Open Domain-Specific Architecture
summary
Defines concrete open chiplet interfaces and a marketplace model, shows working prototypes: a reusable baseboard with three plug‑in accelerator slots, reference packaging descriptions and a chiplet design exchange for bump maps and readiness metadata. Compares short‑reach interconnect options, proposes a PCIe pipe adapter path and experiments with OMI for memory disaggregation, and provides assembly workflows, test criteria and a path to mix chiplets from different vendors into multi‑die DSAs.
AI-written summary · about
chapters (8)
- 0:00Introduction and project overview
- 3:14Domain-specific architectures explained
- 8:53Sharing design information challenges
- 14:20Open Chiplet activities and prototypes
- 21:45Reference architecture and standardization
- 26:11PCIe and disaggregation protocols
- 30:12Memory disaggregation and OMI
- 35:02Call for collaboration and next steps
related talks
18mRealizing a D2D Future
14mSovereign IIoT Data Exchange Using DAG-Based DLT and International Data Spaces Architecture
09mBoardroom: DAO Building Blocks
32mPolkadot Deep Dive: The Blockspace Ecosystem for Boundless Innovation
01h 03mWhat Will it Take to Build a Better Web?
20mFireside Chat
22mDeFi Needs Familiar Entry Points
24mChina’s RISC-V Strategy: Open Spec as JAM Becomes the New Sovereignty
