Exposing The Deep-Secure Elements Of Smartcards
summary
Reverse engineering targets a Samsung printer smartcard IC by mechanically and chemically stripping layers, imaging with a scanning electron microscope, and probing signals through FIB-deposited platinum vias. The work polishes to the logic layer on a 90-nanometer chip, traces ROM decryption logic and parity/XNOR networks, then places 17 needles to tamper instruction flow and capture EEPROM-handled keys; the attack recovers layout and ROM behavior but fails to extract the final secret before the vendor switches chips.
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chapters (7)
- 0:00Introduction and motivation
- 1:10Chip reverse engineering process
- 9:11ROM and cryptographic secrets
- 12:51Active shielding and tampering
- 26:45Decryption logic and anti-tampering
- 34:37Extracting ROM contents and keys
- 36:41Industry impact and aftermath
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