Hack To Discover Weaknesses In A Series Of Smartcards
summary
Old smartcards get fully reverse‑engineered with practical hacks: large optical maps at 100–150× optical imaging find instruction registers and data buses, then targeted FIB edits (FEI DB235) drill 2.6 μm to hit wires, cut the flash bus and strap the boot ROM so two needles read decrypted code. Chips range from 350 nm down to ~140 nm (smallest seen 65 nm), five needles tops, FIB sessions ~6 hours, $350/hr. Result: ROM/flash dumps in minutes for many cards; shields are routinely bypassed.
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chapters (13)
- 0:00Intro
- 1:00The Shield
- 5:25The Chip
- 12:10Instruction Registers
- 14:30AB Miles Chip
- 22:18Atmel AVR
- 26:45AMD Micro
- 29:20Fibber SM
- 35:07Chip Analysis
- 41:05Shield Technology
- 42:42Infineon
- 51:25Shield
- 53:32Question
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