How sand and Java are used to create the world’s most powerful chips
summary
ASML’s EUV workflow prints features at about 2–3 nm accuracy by blasting tin droplets with a ~40 kW laser (50,000 shots) to make plasma, steering EUV with ultra‑flat mirrors (100+ coating layers) and reticles; machines run ~330 wafers/hour and can stack ~200 layers. Each machine emits ~31 TB of telemetry, exposes ~100,000 tunable parameters (including a 4,096‑segment mirror), and feeds a Java platform built on Spring, React, Apache Spark and MongoDB that runs on‑prem. Deep learning raises defect capture from ~70% to ~92% while preserving throughput.
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chapters (7)
- 0:00Introduction to chip making
- 4:36From sand to silicon wafers
- 10:39EUV lithography process
- 18:06Ensuring chip quality and yield
- 23:26Building the Java-based platform
- 31:14Analyzing defect data with Java
- 35:49Q&A session
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