Tezos 2.0: The Next Era of Rollups - Ultra High Throughput
summary
Tezos presents a concrete roadmap: Smart Rollups active since Mumbai and a running DAL (Data Availability Layer) plus DAC support to shard block data across bakers, enabling rollups without small trusted committees. Implementation examples include an EVM rollup (EasyLink) and Michelson/WASM targets; goal is millions of TPS network‑wide and a proposed 1,000,000 TPS single‑machine throughput via parallel signature verification. The plan pairs multi‑language rollup execution, lower L1 latency and migrations from existing rollups to a unified Ultra High Throughput runtime.
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chapters (11)
- 0:00Introduction
- 0:58Roadmap
- 3:18Endgame
- 7:05Interoperability
- 10:22Security Assumption
- 20:22Parallelization
- 25:57Spec Work
- 32:13Compatibility
- 34:27Data Ability Layer
- 37:36Trust
- 43:21Tooling
