How sand and Java are used to create the world’s most powerful chips
summary
ASML’s chip fabrication uses EUV lasers with ~450,000 components and a 40 kW beam hitting 70 m/s tin droplets ~100,000 times per second to print up to 200 layers on wafers holding ~564 dies, reaching ~140 million transistors/mm². Each machine generates ~31 TB/week of metrology data, so a Java-based on‑prem analytics platform (Apache Spark, Spring Boot, React, MongoDB, Neo4j, plugin system) aggregates and corrects settings; a U‑net deep learning step raises defect detection from ~70% to ~93% while keeping an 8× faster scan and on‑device, secure processing.
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chapters (12)
- 0:00Chip manufacturing and ASML
- 1:53Silica sand to silicon wafers
- 6:47Chips printed layer by layer
- 9:58EUV lithography precision
- 16:34Full chip production process
- 17:58EUV vs DUV technology
- 19:01High-NA lithography future
- 21:29Chip defect measurement
- 26:51Java data platform for chips
- 31:27Java powers chip platform
- 36:03Java in chip manufacturing
- 37:35Q&A
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