Firmware Supply Chain Security BoF
summary
Discussion documents concrete failures: UEFI and BMC firmware carry exploitable code (examples BlackLotus and Ring Hopper) that can persist past OS reimages, Microsoft’s signing model prevents easy revocation, and a fix chain can take over a year to reach end customers. Coordinated disclosure stalled on multi‑vendor validation, an event potentially affecting 100 million machines prompted delayed fixes and a Microsoft roadmap toward dual‑certificate revocation finishing in 2024–2025; tooling, SBOMs for firmware, and end‑to‑end supply‑chain coordination are missing.
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chapters (26)
- 0:00Firmware supply chain security intro
- 1:05Why security matters now
- 2:30Ring Hopper vulnerability timeline
- 4:15Multi-vendor firmware issues
- 6:45Intel delays Black Hat talk
- 8:51BMC firmware attack surfaces
- 10:17Black Lotus and UEFI risks
- 13:52Microsoft’s delayed Black Lotus fix
- 15:39Firmware prime target for threats
- 17:03Audience participation call
- 19:32Safe space for collaboration
- 21:40Firmware CVEs and SBOM ecosystems
- 24:50Regulatory pressures ahead
- 28:02SBOM adoption in firmware
- 30:35Supply chain transparency gaps
- 33:25Firmware update tooling
- 34:51Software patterns for firmware
- 37:42Proposing FIRST firmware SIG
- 41:19Defining SIG scope
- 43:04Microsoft’s Black Lotus challenges
- 45:13Incident coordination priorities
- 47:00EO 14028 and SBOM progress
- 49:11Shifting left on firmware
- 50:56SIG needed before regulation
- 52:00Firmware scope for SIG
- 53:05Next steps and closing
related talks
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15mDevice Security Matters More Than Ever
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42mUEFI Bootkits and Where UEFI Security Fails
